Siva Prakash Gurrum

This inventor holds 28 USPTO granted patents, primarily in Semiconductor Packaging. Top assignee: Texas Instruments Corporation. Active years: 2009-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Siva Prakash Gurrum. Retrieved from https://idiyas.com/inventor/siva-prakash-gurrum

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 28

% Patents Active = 100.0

Average Co-Inventor Count = 3.1

ph-index = 5

Forward Citations = 83(Granted Patents)

Location History:

Irving, TX (US) (2010 - 2012)
Dallas, TX (US) (2009 - 2015)
Allen, TX (US) (2015 - 2024)

Company Filing History:

28 out of 29,888

Texas Instruments Corporation

patents

Years Active: 2009-2025

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Areas of Expertise:

Thermal Dissipation

Wire Bond Detection

Multichip Module

Conductive Connectors

Filler Particles

Etched Foil Capacitor

Peak Current Density

Thermal Interface Material

Heat Extraction

Stud Bumps

Coaxial Probe

Agglomerate Terminals

28 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12412800 - Integrated circuit package having enhanced thermal dissipation structure (2025-09-09),

2. 12159808 - Wire bond damage detector including a detection bond pad over a first and a second connected structures (2024-12-03),

3. 11869820 - IC having a metal ring thereon for stress reduction (2024-01-09),

4. 11538742 - Packaged multichip module with conductive connectors (2022-12-27),

5. 11521904 - Wire bond damage detector including a detection bond pad over a first and a second connected structures (2022-12-06),

6. 11430719 - Spot-solderable leads for semiconductor device packages (2022-08-30),

7. 11387155 - IC having a metal ring thereon for stress reduction (2022-07-12),

8. 11139178 - Semiconductor package with filler particles in a mold compound (2021-10-05),

9. 11121049 - Semiconductor package with a wire bond mesh (2021-09-14),

10. 10622290 - Packaged multichip module with conductive connectors (2020-04-14),

11. 10607927 - Spot-solderable leads for semiconductor device packages (2020-03-31),

12. 10497643 - Patterned die pad for packaged vertical semiconductor devices (2019-12-03),

13. 10446414 - Semiconductor package with filler particles in a mold compound (2019-10-15),

14. 10204842 - Semiconductor package with a wire bond mesh (2019-02-12),

15. 9373572 - Semiconductor package having etched foil capacitor integrated into leadframe (2016-06-21),

Title: Inventor Siva Prakash Gurrum

Introduction: Siva Prakash Gurrum is a talented inventor based in Allen, Texas, known for his innovative contributions in various fields.

Latest Patents: Siva Prakash Gurrum holds several patents in the areas of technology and engineering, showcasing his dedication to pushing the boundaries of innovation.

Career Highlights: With a successful career spanning over a decade, Siva Prakash Gurrum has worked on groundbreaking projects that have made a significant impact in the industry.

Collaborations: Throughout his career, Siva Prakash Gurrum has collaborated with leading experts and organizations to bring his inventions to life, demonstrating his ability to work effectively in team settings.

Conclusion: Siva Prakash Gurrum's passion for innovation and his commitment to excellence continue to drive his success as a prominent inventor in Allen, Texas.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]