The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 15, 2019
Filed:
Dec. 22, 2017
Applicant:
Texas Instruments Incorporated, Dallas, TX (US);
Inventors:
Amit Sureshkumar Nangia, Murphy, TX (US);
Siva Prakash Gurrum, Allen, TX (US);
Janakiraman Seetharaman, Bengaluru, IN;
Assignee:
TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/56 (2006.01); H01L 23/29 (2006.01); H01L 23/495 (2006.01); C08G 59/18 (2006.01); H01L 23/64 (2006.01); H01L 23/522 (2006.01); H01L 23/00 (2006.01); H01L 23/50 (2006.01);
U.S. Cl.
CPC ...
H01L 21/565 (2013.01); C08G 59/18 (2013.01); H01L 23/295 (2013.01); H01L 23/495 (2013.01); H01L 23/50 (2013.01); H01L 23/5223 (2013.01); H01L 23/642 (2013.01); H01L 24/03 (2013.01);
Abstract
A semiconductor package includes an integrated circuit formed on a semiconductor substrate. A stress buffer layer is provided on the integrated circuit. Further, a mold compound is provided on a surface of the stress buffer layer opposite the integrated circuit. The mold compound comprises a resin. The resin includes filler particles. The filler particles have multiple sizes with the largest of the particles having a size between 5 microns and 32 microns.