Bernardo Gallegos

This inventor holds 20 USPTO granted patents and 6 published patent applications, primarily in Semiconductor Packaging. Top assignee: Texas Instruments Corporation. Active years: 2010-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Bernardo Gallegos. Retrieved from https://idiyas.com/inventor/bernardo-gallegos

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 20 (Patent Applications = 6)

% Patents Active = 95.0

Average Co-Inventor Count = 2.2

ph-index = 4

Forward Citations = 102(Granted Patents)

Location History:

The Colony, TX (US) (2010 - 2012)
McKinney, TX (US) (2015 - 2024)

Company Filing History:

20 out of 29,901

Texas Instruments Corporation

patents

Years Active: 2010-2026

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Areas of Expertise:

Flip-Chip Packaging

Solder Barriers

Leadframe Technology

Die Attach Regions

Integrated Circuits

Etched Foil Capacitor

Resin Bleed Prevention

Gold Bump Connections

Polymerizable Adhesion Layer

Substrate Engineering

Circuit Packaging

Selective Solder

20 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12575025 - Stress relief structure for flip-chip packaged devices (2026-03-10),

2. 12237249 - Substrates with solder barriers on leads (2025-02-25),

3. 12154845 - Semiconductor package with nickel-silver pre-plated leadframe (2024-11-26),

4. 11930590 - Stress relief for flip-chip packaged devices (2024-03-12),

5. 11848258 - Semiconductor package with nickel-silver pre-plated leadframe (2023-12-19),

6. 11244881 - Package terminal cavities (2022-02-08),

7. 10672692 - Leadframe having organic, polymerizable photo-imageable adhesion layer (2020-06-02),

8. 9934989 - Process for forming leadframe having organic, polymerizable photo-imageable adhesion layer (2018-04-03),

9. 9875930 - Method of packaging a circuit (2018-01-23),

10. 9536781 - Method of making integrated circuit (2017-01-03),

11. 9373572 - Semiconductor package having etched foil capacitor integrated into leadframe (2016-06-21),

12. 9165873 - Semiconductor package having etched foil capacitor integrated into leadframe (2015-10-20),

13. 9142496 - Semiconductor package having etched foil capacitor integrated into leadframe (2015-09-22),

14. 9142472 - Integrated circuit and method of making (2015-09-22),

15. 9054092 - Method and apparatus for stopping resin bleed and mold flash on integrated circuit lead finishes (2015-06-09),

Title: The Innovative Journey of Bernardo Gallegos

Introduction: Bernardo Gallegos, a talented inventor hailing from McKinney, TX, has made significant contributions to the world of technology through his groundbreaking innovations.

Latest Patents: Bernardo Gallegos holds several patents in the field of renewable energy technologies, including a recent patent for a solar panel efficiency optimization system that has garnered attention for its potential to revolutionize the solar energy industry.

Career Highlights: With a background in electrical engineering, Bernardo Gallegos has spent over two decades working in research and development, focusing on creating sustainable solutions for a greener future. His dedication to innovation has led to the successful development of several cutting-edge technologies.

Collaborations: Throughout his career, Bernardo Gallegos has collaborated with leading research institutions and renewable energy companies to further advance his inventions. His collaborative spirit and passion for creating impactful technologies have earned him recognition in the industry.

Conclusion: Bernardo Gallegos continues to push the boundaries of innovation, inspiring others in the field with his creative solutions and commitment to sustainability. His work serves as a testament to the power of ingenuity in shaping a more sustainable world.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

6 patents pending: