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Darvin R Edwards

This inventor holds 27 USPTO granted patents and 4 EPO patents, primarily in Semiconductor Packaging. Top assignees: Texas Instruments Corporation, Hitachi, Ltd.. Active years: 1992-2017.

USPTO Granted Patents = 27

% Patents Active = 100.0

EPO Patents = 4

Average Co-Inventor Count = 2.1

ph-index = 12

Forward Citations = 697(Granted Patents)

Location History:

Dallas, TX (US) (1992 - 1995)
Garland, TX (US) (1996 - 2017)

Company Filing History:

27 out of 29,869

Texas Instruments Corporation

where one patent can have more than one assignee

Years Active: 1992-2017

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Areas of Expertise:

Thermal Management

Semiconductor Package

Agglomerate Terminals

Heat Sink

Copper Metallization

Ball Grid Array

Chip-Size Packages

Mechanical Performance

Multi-Chip Module

Interposer

Stress Absorbing Film

Wafer-Scale Assembly

27 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 9698075 - Integration of backside heat spreader for thermal management (2017-07-04),

2. 9496198 - Integration of backside heat spreader for thermal management (2016-11-15),

3. 9373572 - Semiconductor package having etched foil capacitor integrated into leadframe (2016-06-21),

4. 9165873 - Semiconductor package having etched foil capacitor integrated into leadframe (2015-10-20),

5. 9142496 - Semiconductor package having etched foil capacitor integrated into leadframe (2015-09-22),

6. 8716068 - Method for contacting agglomerate terminals of semiconductor packages (2014-05-06),

7. 8643165 - Semiconductor device having agglomerate terminals (2014-02-04),

8. 7892889 - Array-processed stacked semiconductor packages (2011-02-22),

9. 7495749 - Rapid method for sub-critical fatigue crack growth evaluation (2009-02-24),

10. 7296168 - Method and apparatus to minimize power and ground bounce in a logic device (2007-11-13),

11. 7291913 - System and method for high performance heat sink for multiple chip devices (2007-11-06),

12. 7267861 - Solder joints for copper metallization having reduced interfacial voids (2007-09-11),

13. 7174194 - Temperature field controlled scheduling for processing systems (2007-02-06),

14. 6979899 - System and method for high performance heat sink for multiple chip devices (2005-12-27),

15. 6950310 - System and method for self-leveling heat sink for multiple height devices (2005-09-27),

Title: The Innovative Mind of Darvin R Edwards

Introduction: Darvin R Edwards, a talented inventor hailing from Garland, TX (US), is known for his groundbreaking contributions to the world of technology and innovation.

Latest Patents: Darvin R Edwards has recently been granted several patents for his cutting-edge inventions in the fields of robotics and artificial intelligence, solidifying his reputation as a forward-thinker in the industry.

Career Highlights: With a career spanning over two decades, Darvin R Edwards has worked tirelessly to push the boundaries of what is possible in the realm of technology. His innovative spirit and dedication to his craft have led to numerous successful projects and inventions that have had a lasting impact on the industry.

Collaborations: Throughout his career, Darvin R Edwards has collaborated with some of the brightest minds in the field, pooling their collective expertise to bring revolutionary ideas to life. His ability to work effectively in a team setting has been instrumental in the success of many of his projects.

Conclusion: Darvin R Edwards continues to inspire and innovate, leaving an indelible mark on the world of technology. His passion for pushing the boundaries of what is possible knows no bounds, and the industry eagerly anticipates his next groundbreaking invention.

Profile summary based on public USPTO records.

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