The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 11, 2007
Filed:
May. 31, 2005
Applicants:
Darvin R. Edwards, Garland, TX (US);
Tz-cheng Chiu, Plano, TX (US);
Kejun Zeng, Coppell, TX (US);
Inventors:
Assignee:
Texas Instruments Incorporated, Dallas, TX (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
Abstract
A metal interconnect structure () comprising a bond pad (), which has copper with at least 70 volume percent composed of crystal grains expanding more than 1 μm in their main direction, and 30 or less volume percent composed of crystal grains, which expand less than 1 μm in their main crystal direction. A body () of tin alloy is in contact with the bond pad.