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Coppell, TX, United States of America

Kejun Zeng

USPTO Granted Patents = 7 (Patent Applications = 3)

EPO Patents = 1

Average Co-Inventor Count = 1.4

ph-index = 3

Forward Citations = 36(Granted Patents)

Company Filing History:

7 out of 29,232

Texas Instruments Corporation

Years Active: 2005-2017

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7 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 9646950 - Corrosion-resistant copper bonds to aluminum (2017-05-09),

2. 7939939 - Stable gold bump solder connections (2011-05-10),

3. 7291549 - Method and structure to reduce risk of gold embrittlement in solder joints (2007-11-06),

4. 7267861 - Solder joints for copper metallization having reduced interfacial voids (2007-09-11),

5. 7070088 - Method of semiconductor device assembly including fatigue-resistant ternary solder alloy (2006-07-04),

6. 7005745 - Method and structure to reduce risk of gold embrittlement in solder joints (2006-02-28),

7. 6867503 - Controlling interdiffusion rates in metal interconnection structures (2005-03-15),

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