Company Filing History:
Years Active: 2005-2017
Title: The Innovative Contributions of Kejun Zeng
Introduction
Kejun Zeng is a prominent inventor based in Coppell, TX (US), known for his significant contributions to semiconductor technology. With a total of 7 patents, Zeng has made remarkable advancements in the field, particularly in the area of corrosion-resistant materials and stable solder connections.
Latest Patents
Zeng's latest patents include a method for fabricating a semiconductor device that features corrosion-resistant copper bonds to aluminum. This innovative approach involves a packaged semiconductor device with copper ball bonds attached to aluminum pads, treated at specific temperatures to enhance stability. Another notable patent focuses on creating stable gold bump solder connections, which utilize a complex interconnect structure to ensure that gold/tin intermetallics remain free of copper, thus avoiding the formation of ternary compounds.
Career Highlights
Kejun Zeng is currently employed at Texas Instruments Corporation, where he continues to push the boundaries of semiconductor technology. His work has been instrumental in developing reliable and efficient connections in semiconductor devices, which are crucial for modern electronics.
Collaborations
Throughout his career, Zeng has collaborated with esteemed colleagues such as Wei Qun Peng and Rebecca L Holford. These partnerships have fostered a collaborative environment that enhances innovation and drives technological advancements.
Conclusion
Kejun Zeng's contributions to the field of semiconductor technology are noteworthy and impactful. His innovative patents and collaborations reflect his dedication to advancing the industry and improving the reliability of electronic devices.