The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 10, 2011
Filed:
Oct. 04, 2007
Kejun Zeng, Coppell, TX (US);
Wei Qun Peng, Coppell, TX (US);
Rebecca L. Holford, Garland, TX (US);
Robert John Furtaw, Dallas, TX (US);
Bernardo Gallegos, The Colony, TX (US);
Kejun Zeng, Coppell, TX (US);
Wei Qun Peng, Coppell, TX (US);
Rebecca L. Holford, Garland, TX (US);
Robert John Furtaw, Dallas, TX (US);
Bernardo Gallegos, The Colony, TX (US);
Texas Instruments Incorporated, Dallas, TX (US);
Abstract
A metallic interconnect structure () for connecting a gold bump () and a copper pad (), as used for example in semiconductor flip-chip assembly. A first region () of binary AuSnintermetallic is adjacent to the gold bump. A region () of binary AuSnintermetallic is adjacent to the first AuSnregion. Then, a region () of binary gold-tin solid solution is adjacent to the AuSnregion, and a second region () of binary AuSnintermetallic is adjacent to the solid solution region. The second AuSnregion is adjacent to a nickel layer () (preferred thickness about 0.08 μm), which covers the copper pad. The nickel layer insures that the gold/tin intermetallics and solutions remain substantially free of copper and thus avoid ternary compounds, providing stabilized gold bump/solder connections.