This inventor holds 2 USPTO granted patents and 1 published patent application. Top assignee: Texas Instruments Corporation. Active years: 2007-2011.
Location History:
- Frisco, TX (US) (2007)
- Dallas, TX (US) (2011)
Company Filing History:
Years Active: 2007-2011
Title: Innovations by Robert John Furtaw
Introduction
Robert John Furtaw is an accomplished inventor based in Dallas, TX (US). He has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. His work focuses on improving the reliability and performance of electronic devices.
Latest Patents
Furtaw's latest patents include "Stable Gold Bump Solder Connections" and "Semiconductor Device Having Resin Anti-Bleed Feature." The first patent describes a metallic interconnect structure designed for connecting a gold bump to a copper pad, which is crucial in semiconductor flip-chip assembly. This invention ensures that gold/tin intermetallics and solutions remain free of copper, thus avoiding ternary compounds and stabilizing the connections. The second patent outlines a method for controlling resin bleed in semiconductor devices, featuring a substrate with a barrier that prevents adhesive components from bleeding onto the exterior region of the surface.
Career Highlights
Furtaw is currently employed at Texas Instruments Corporation, where he continues to innovate in the semiconductor industry. His work has contributed to advancements in device reliability and performance, making a significant impact on the technology sector.
Collaborations
Some of his notable coworkers include Kejun Zeng and Wei Qun Peng, who have collaborated with him on various projects within Texas Instruments Corporation.
Conclusion
Robert John Furtaw's contributions to semiconductor technology through his patents and work at Texas Instruments Corporation highlight his role as a key innovator in the field. His inventions are paving the way for more reliable electronic devices.