The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 15, 2005
Filed:
May. 07, 2003
Kejun Zeng, Coppell, TX (US);
Kejun Zeng, Coppell, TX (US);
Texas Instruments Incorporated, Dallas, TX (US);
Abstract
A metal interconnection structure for semiconductor chips has a metal interface layer (), preferably nickel, deposited over the metal of the chip contact pad (, usually aluminum or copper). A subsequent metal layer () is an alloy of a metal such as copper or gold with nickel, wherein the quantity of nickel is selected so that it diminishes the interdiffusion rate of the nickel from the interface layer () during the reflow and annealing processes. Reflowable metal () for interconnection completes the structure. In another embodiment, the reflowable metal () contains an admixture of the interface metal in a quantity to diminish the interdiffusion rate of metal from the interface layer during the annealing process. In either embodiment, the formation of voids in the interface layer () is diminished.