The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 09, 2017
Filed:
Feb. 02, 2016
Applicant:
Texas Instruments Incorporated, Dallas, TX (US);
Inventors:
Kejun Zeng, Coppell, TX (US);
Amit Sureshkumar Nangia, Murphy, TX (US);
Assignee:
TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 24/85 (2013.01); H01L 21/56 (2013.01); H01L 24/48 (2013.01); H01L 24/05 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/4845 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48507 (2013.01); H01L 2224/48824 (2013.01); H01L 2224/85035 (2013.01); H01L 2224/85205 (2013.01); H01L 2224/85948 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/3862 (2013.01);
Abstract
A method for fabricating a semiconductor device is disclosed. A packaged semiconductor device is provided having copper ball bonds attached to aluminum pads. The packaged device is treated for at least one cycle at a temperature in the range from about 250° C. to 270° C. for a period of time in the range from about 20 s to 40 s.