Tz-Cheng Chiu

Title: Tz-Cheng Chiu: Innovator in Electronic Circuit Board Technology

Introduction

Tz-Cheng Chiu is a prominent inventor based in Plano, TX (US), known for his significant contributions to electronic circuit board technology. With a total of 13 patents to his name, he has made remarkable advancements in the field, particularly in the design and functionality of semiconductor packages.

Latest Patents

One of Tz-Cheng Chiu's latest patents is focused on raised solder-mask-defined (SMD) solder ball pads for laminate electronic circuit boards. This innovation involves a raised SMD pad designed to receive a solder ball, along with a method for creating this pad. The process includes forming a base bump, covering it with a conductive bump layer, and layering surrounding material over the edge of the conductive layer. The surrounding material is then patterned to expose a pad face, ensuring that the pad face is elevated above the surrounding material's surface. This can be achieved through photolithography or laser-drill operations.

Another notable patent addresses the arrangement in semiconductor packages to inhibit adhesion of the lid to the substrate while providing compression support. In this design, a semiconductor flip-chip package incorporates a semiconductor die as part of a substrate assembly. The lid and substrate are supported to prevent tilting, and they do not adhere to each other, which reduces the risk of solder joint cracking due to thermal cycling. An adhesion prohibitor is applied to ensure that the support does not adhere to both the lid and substrate, which can be achieved through a separate curing step. This innovative arrangement can be applied to various package types, including ball grid array (BGA) and land grid array (LGA) packages.

Career Highlights

Tz-Cheng Chiu is currently employed at Texas Instruments Corporation, where he continues to develop cutting-edge technologies in the semiconductor industry. His work has significantly impacted the efficiency and reliability of electronic devices.

Collaborations

Throughout his career, Tz-Cheng has collaborated with notable colleagues, including Manjula N Variyam and Charles Anthony Odegard. These collaborations have further enhanced the innovative solutions he brings to the field.

Conclusion

Tz-Cheng Chiu's contributions to electronic circuit board technology and semiconductor packaging demonstrate his expertise and commitment to innovation. His patents reflect a deep understanding of the complexities involved in modern electronics, making