The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 24, 2004
Filed:
Aug. 08, 2002
Applicant:
Inventors:
Tz-Cheng Chiu, Plano, TX (US);
Manjula N. Variyam, Plano, TX (US);
Assignee:
Texas Instruments Incorporated, Dallas, TX (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/328 ;
U.S. Cl.
CPC ...
H01L 2/328 ;
Abstract
A plastic package for use in semiconductor devices, which has a plurality of metallic terminals exposed on a package surface and a metallic bump attached to each of said terminals. The bumps are made of reflowable metal and have approximately uniform height. An adherent layer of polymer material covers the package surface and surrounds each of the bumps to form a solid meniscus. The layer has a thickness between a quarter and one half of the bump height. An analogous methodology applies to plastic assembly boards.