Texas Instruments Corporation

Tz-Cheng Chiu

Charles Anthony Odegard

Manjula N Variyam

Rajiv Carl Dunne

Vinu Yamunan

Jiong-Ping Lu

Qi-Zhong Hong

Ting Yiu Tsui

Darvin R Edwards

Changming Jin

Mohammad Yunus

Kejun Zeng

David Permana

A raised solder-mask-defined (SMD) pad configured for receiving a solder ball on a laminate electronic circuit board and a method of creating the raised SMD pad on a laminate electronic circuit board. The method may comprise forming a base bump, covering the base bump with a conductive bump layer and layering a surrounding material over an extended edge of the conductive bump layer. The surrounding material is patterned to expose a pad face and of a portion of the sides of the conductive bump layer, such that the pad face is disposed above the surface of the surrounding material. The surrounding material may be patterned by a photolithography operation or alternatively, a laser-drill operation.

Raised solder-mask-defined (SMD) solder ball pads for a laminate electronic circuit board

In a semiconductor flip-chip package having a semiconductor die as part of a substrate assembly, a lid (or lid assembly) and substrate are supported to prevent tilting and teetering of the lid. The lid and substrate do not adhere, so as to reduce cracking of solder joints due to thermal cycling induced by repeated system power on-off. An adhesion prohibitor may be applied so that a support does not adhere to both lid and substrate; the support may be prevented from adhering to both lid and substrate by a separate curing step. The arrangements and fabrication methods may be applied to many package types, including ball grid array (BGA) and land grid array (LGA) packages.

Arrangement in semiconductor packages for inhibiting adhesion of lid to substrate while providing compression support

Disclosed are integrated circuit assemblies with increased stand-off height and methods and systems for their manufacture. Methods of the invention provide for assembling a semiconductor device by aligning a die with a substrate and interposing solder between corresponding substrate and die bond pads. A lifting force is applied to the die during heating of the solder to a liquescent state, thereby increasing the stand-off height of the die above the substrate. The lifting force is maintained during cooling of the solder to a solid state, thereby forming increased stand-off height solder connections.

Increased stand-off height integrated circuit assemblies, systems, and methods

A system () for manufacturing product, in which a first work station () is operable to perform a first manufacturing action on the product parts; this first station has a first entrance () and a first exit). A second work station () is operable to perform a second manufacturing action on the product parts; this second station has a second entrance () and a second exit (). A transport line () between the first exit and the second entrance is operable to move the product parts under computer control. A chamber () encloses a portion of the line and is constructed so that the transport achieves a balanced throughput from the first station to the second station, while the product parts are exposed to computer-controlled environmental conditions () during transport through the chamber. The balanced throughput in the chamber is achieved by waiting lines for the product with computer-controlled monitors () for product parts' positions and times in the chamber.

Manufacturing system and apparatus for balanced product flow with application to low-stress underfilling of flip-chip electronic devices

A metal interconnect structure () comprising a bond pad (), which has copper with at least 70 volume percent composed of crystal grains expanding more than 1 &#x3bc;m in their main direction, and 30 or less volume percent composed of crystal grains, which expand less than 1 &#x3bc;m in their main crystal direction. A body () of tin alloy is in contact with the bond pad.

Solder joints for copper metallization having reduced interfacial voids

In a semiconductor flip-chip package having a semiconductor dieas part of a substrate assembly, a lid(or lid assembly) and substrateare supported to prevent tilting and teetering of the lid. The lid and substrate do not adhere, so as to reduce cracking of solder joints due to thermal cycling induced by repeated system power on-off. An adhesion prohibitormay be applied so that a supportdoes not adhere to both lid and substrate; the supportmay be prevented from adhering to both lid and substrate by a separate curing step. The arrangements and fabrication methods may be applied to many package types, including ball grid array (BGA) and land grid array (LGA) packages.

Disclosed is a system for fabricating a semiconductor device (). An interconnect structure () is formed on the semiconductor device () and a cap () is deposited over the interconnect structure (). The interconnect structure () is annealed with the overlying cap () in place. The cap () is then removed after the interconnect structure () is annealed.

System for improving thermal stability of copper damascene structure

A composite lid for a semiconductor package, in which the lid includes at least two materials. The first material is disposed over and attached to the back surface of the die with a low-modulus thermal gel, and the second material is disposed towards the perimeter of the lid. The second material has a modulus of elasticity greater than the modulus of elasticity of the first material, and preferable, at least twice that of the first material.

Composite lid for land grid array (LGA) flip-chip package assembly

A composite lid for a semiconductor package, in which the lid includes at least two materials. The first material is disposed over and attached to the back surface of the die with a low-modulus thermal gel and the second material is disposed towards the perimeter of the lid. The second material has a modulus of elasticity greater than the modulus of elasticity of the first material, and preferably, at least twice that of the first material.

Electronic devices of improved reliability having a substrate of electrically insulating material, further an integrated circuit chip with a periphery and a surface. Using a layer of polymeric material, the chip surface is mounted on the substrate surface. The polymeric material protrudes beyond the chip periphery and spreads some distance along the substrate surface. A metal layer is on the substrate surface, this layer is shaped as a band around the chip periphery; the band has an inner edge near the chip periphery, and an outer edge near the contour of the polymer protrusion. This metal band serves as a guard ring to stop any nascent crack propagating in the polymer protrusion.

Flip-chip device strengthened by substrate metal ring

A plastic package for use in semiconductor devices, which has a plurality of metallic terminals exposed on a package surface and a metallic bump attached to each of said terminals. The bumps are made of reflowable metal and have approximately uniform height. An adherent layer of polymer material covers the package surface and surrounds each of the bumps to form a solid meniscus. The layer has a thickness between a quarter and one half of the bump height. An analogous methodology applies to plastic assembly boards.

Growing community of inventors

Plano, TX, United States of America

Tz-Cheng Chiu