The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 07, 2010
Filed:
Jun. 06, 2008
Satyendra S. Chauhan, Sugar Land, TX (US);
Rajiv C. Dunne, Murphy, TX (US);
Gary P. Morrison, Garland, TX (US);
Masood Murtuza, Sugar Land, TX (US);
Satyendra S. Chauhan, Sugar Land, TX (US);
Rajiv C. Dunne, Murphy, TX (US);
Gary P. Morrison, Garland, TX (US);
Masood Murtuza, Sugar Land, TX (US);
Texas Instruments Incorporated, Dallas, TX (US);
Abstract
A method used during the formation of a semiconductor device assembly can include contacting an end of a conductive bump (which can be a pillar, ball, pad, post, stud, or lead as well as other types of bumps) with a conductive powder such as a solder powder to adhere the conductive powder to the end of the bump. The powder can be flowed, for example by heating, to distribute it across the end of the bump. The flowed powder can be placed in contact with a conductive pad of a receiving substrate and can then be reflowed to facilitate electrical connection between the bump and the conductive pad.