Sugar Land, TX, United States of America

Satyendra Singh Chauhan

This inventor holds 26 USPTO granted patents, primarily in Semiconductor Packaging. Top assignee: Texas Instruments Corporation. Active years: 2005-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Satyendra Singh Chauhan. Retrieved from https://idiyas.com/inventor/satyendra-singh-chauhan

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 8

Forward Citations = 363(Granted Patents)


Location History:

  • Dallas, TX (US) (2012)
  • Sugar Land, TX (US) (2005 - 2018)
  • Murphy, TX (US) (2021 - 2024)

Company Filing History:


Years Active: 2005-2026

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Areas of Expertise:
Flip-Chip Packaging
TSV Connections
Multi-Chip Modules
Stress Relief Structure
Hall-Effect Sensors
Solder Standoff
Cavity Substrate Fabrication
Die Stacking Scheme
Voltage Regulated Shield
Copper Bump Process
Fine Pitch Substrate
Bonding IC Die
26 patents (USPTO):Explore Patents

Title: Satyendra Singh Chauhan: Pioneering Innovator with 23 Patents

Introduction:

Satyendra Singh Chauhan, based in Sugar Land, TX, is an esteemed inventor and a key contributor in advancing technological innovations. With an impressive portfolio comprising 23 patents, Chauhan has made significant breakthroughs in the field of electronics. This article delves into his latest patents, highlights his career achievements, and showcases his collaborations with notable individuals and companies.

Latest Patents:

Chauhan's latest patents demonstrate his expertise in developing cutting-edge electronic devices. One such patent is for a conductive plate stress reduction feature. This packaged electronic device includes a semiconductor die, a conductive plate, a solder structure, and a package structure. By effectively reducing stress on the semiconductor die, this invention enhances the reliability and performance of electronic devices.

Another significant patent by Chauhan is the development of a Hall-effect sensor package with an added current path. This innovation incorporates an IC die featuring a Hall-Effect element, along with a leadframe that provides multiple field generating current (FGC) paths. The addition of a clip further enhances the functionality and precision of the Hall-effect sensor package.

Career Highlights:

During his career, Chauhan has consistently pushed the boundaries of innovation. Starting at Texas Instruments Corporation, a global leader in semiconductor design and manufacturing, Chauhan has displayed exceptional technical prowess and a deep understanding of electronics.

Collaborations:

Throughout his career, Chauhan has actively collaborated with industry experts and fellow inventors to create groundbreaking solutions. Notably, he has joined forces with Masood Murtuza and Rajiv Carl Dunne, both respected professionals in the field of electronics. Together, they have collectively contributed to expanding the realm of electronic device packaging and sensor technology.

Conclusion:

Satyendra Singh Chauhan's remarkable journey as an inventor has left an indelible mark on the field of electronic device packaging and sensor technology. With 23 patents to his name, Chauhan continues to drive innovation and pave the way for advancements in the industry. Collaborating with esteemed professionals and consistently delivering groundbreaking inventions, Chauhan's contributions deserve recognition and inspire future generations of inventors and innovators in the field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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