The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 07, 2013

Filed:

Apr. 11, 2012
Applicants:

Rajiv Dunne, Murphy, TX (US);

Gary P. Morrison, Garland, TX (US);

Satyendra S. Chauhan, Sugarland, TX (US);

Masood Murtuza, Sugarland, TX (US);

Thomas D. Bonifield, Dallas, TX (US);

Inventors:

Rajiv Dunne, Murphy, TX (US);

Gary P. Morrison, Garland, TX (US);

Satyendra S. Chauhan, Sugarland, TX (US);

Masood Murtuza, Sugarland, TX (US);

Thomas D. Bonifield, Dallas, TX (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor device includes an integrated circuit (IC) die including a substrate, and a plurality of through substrate via (TSV) that extends through the substrate to a protruding integral tip and which is partially covered with a dielectric liner and partially exposed from the dielectric liner. A metal layer is on the bottom surface of the IC die physically connecting the plurality of TSVs and physically and electrically connected to connecting the first metal protruding tips of TSVs.


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