IDiyas

For the Inventor, By the Inventor

Garland, TX, United States of America

Gary Paul Morrison

USPTO Granted Patents = 11 

Average Co-Inventor Count = 3.5

ph-index = 4

Forward Citations = 41(Granted Patents)


Location History:

  • Garland, TX (US) (2004 - 2019)
  • South Point, OH (US) (2023)

Company Filing History:

goldMedal10 out of 29,232 
 
Texas Instruments Corporation
 patents
where one patent can have more than one assignee

Years Active: 2004-2023

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11 patents (USPTO):
1. 11753272 - Mobile reel carrier (2023-09-12),
2. 10262957 - Millimeter wave integrated circuit with ball grid array package including transmit and receive channels (2019-04-16),
3. 9941228 - Millimeter wave integrated circuit with ball grid array package including transmit and receive channels (2018-04-10),
4. 9666553 - Millimeter wave integrated circuit with ball grid array package including transmit and receive channels (2017-05-30),
5. 8436475 - IC device having low resistance TSV comprising ground connection (2013-05-07),
6. 8431481 - IC device having low resistance TSV comprising ground connection (2013-04-30),
7. 8178976 - IC device having low resistance TSV comprising ground connection (2012-05-15),
8. 8154134 - Packaged electronic devices with face-up die having TSV connection to leads and die pad (2012-04-10),
9. 7790597 - Solder cap application process on copper bump using solder powder film (2010-09-07),
10. 7462783 - Semiconductor package having a grid array of pin-attached balls (2008-12-09),
11. 6762498 - Ball grid array package for high speed devices (2004-07-13),
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