The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 10, 2018

Filed:

Apr. 25, 2017
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Rajen Manicon Murugan, Garland, TX (US);

Minhong Mi, Newton Center, MA (US);

Gary Paul Morrison, Garland, TX (US);

Jie Chen, Denton, TX (US);

Kenneth Robert Rhyner, Rockwall, TX (US);

Stanley Craig Beddingfield, Austin, TX (US);

Chittranjan Mohan Gupta, Richardson, TX (US);

Django Earl Trombley, Dallas, TX (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/00 (2006.01); H01L 23/66 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); H05K 1/18 (2006.01); H05K 1/02 (2006.01); H01Q 1/22 (2006.01); H01Q 1/32 (2006.01); H01Q 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 23/49816 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 24/48 (2013.01); H01Q 1/2283 (2013.01); H01Q 1/3233 (2013.01); H05K 1/0245 (2013.01); H05K 1/181 (2013.01); H01L 2223/6611 (2013.01); H01L 2223/6627 (2013.01); H01L 2223/6655 (2013.01); H01L 2223/6677 (2013.01); H01L 2223/6683 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/1423 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/30111 (2013.01); H01Q 23/00 (2013.01); H05K 2201/10734 (2013.01);
Abstract

A millimeter wave integrated circuit (IC) chip. The IC chip comprises an IC die and a wire bond ball grid array package encapsulating the IC die. The wire bond ball grid array package comprises a solder ball array, a millimeter wave transmit channel, and a millimeter wave receive channel, wherein each millimeter wave transmit and receive channel electrically couples the IC die to a signal ball of the solder ball array and is configured to resonate at an operating frequency band of the millimeter wave IC chip.


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