IDiyas

For the Inventor, By the Inventor

Austin, TX, United States of America

Stanley Craig Beddingfield

USPTO Granted Patents = 10 

Average Co-Inventor Count = 2.2

ph-index = 7

Forward Citations = 449(Granted Patents)


Location History:

  • McKinney, TX (US) (2010 - 2012)
  • Austin, TX (US) (1998 - 2019)

Company Filing History:

goldMedal6 out of 29,232 
 
Texas Instruments Corporation
 patents
silverMedal4 out of 20,290 
 
Motorola Corporation
 patents

Years Active: 1998-2019

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10 patents (USPTO):
1. 10262957 - Millimeter wave integrated circuit with ball grid array package including transmit and receive channels (2019-04-16),
2. 9941228 - Millimeter wave integrated circuit with ball grid array package including transmit and receive channels (2018-04-10),
3. 9666553 - Millimeter wave integrated circuit with ball grid array package including transmit and receive channels (2017-05-30),
4. 8304867 - Crack arrest vias for IC devices (2012-11-06),
5. 8049119 - Integrated circuit package having integrated faraday shield (2011-11-01),
6. 7741567 - Integrated circuit package having integrated faraday shield (2010-06-22),
7. 6372622 - Fine pitch bumping with improved device standoff and bump volume (2002-04-16),
8. 5977632 - Flip chip bump structure and method of making (1999-11-02),
9. 5726502 - Bumped semiconductor device with alignment features and method for (1998-03-10),
10. 5710071 - Process for underfilling a flip-chip semiconductor device (1998-01-20),
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