The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 16, 2002
Filed:
Oct. 26, 1999
Qing Tan, Austin, TX (US);
Stanley Craig Beddingfield, Austin, TX (US);
Douglas G. Mitchell, Tempe, AZ (US);
Motorola, Inc., Schaumburg, IL (US);
Abstract
Embodiments of the present invention relate generally to solder bump formation and semiconductor device assemblies. One embodiment related to a method for forming a bump structure includes providing a semiconductor device ( ) having a bond pad ( ), and forming a first masking layer ( ) overlying the bond pad ( ). The first masking layer ( ) is patterned to form a first opening ( ) overlying at least a portion of the bond pad ( ). A second masking layer ( ) is formed overlying the first masking layer ( ), and the second masking layer ( ) is patterned to form a second opening ( ) overlying at least a portion of the first opening ( ). The method further includes forming a stud ( ) at least within the first opening ( ) and a solder bump ( ) at least within the second opening ( ).