The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 01, 2011
Filed:
May. 07, 2010
Stanley C Beddingfield, McKinney, TX (US);
Jean-francois Drouard, LeRouret, FR;
Stanley C Beddingfield, McKinney, TX (US);
Jean-Francois Drouard, LeRouret, FR;
Texas Instruments Incorporated, Dallas, TX (US);
Abstract
A packaged integrated circuit (IC) () includes a first substrate () comprising a first plurality of layers and a first circuit coupling features () at an upper surface of the first substrate (), the first plurality of layers including a first electromagnetic interference shielding layer (). The packaged IC also includes a second substrate () having an upper surface attached to a lower surface of the first substrate () by an electrically conductive adhesive material (). The second substrate () includes a second plurality of layers and a second circuit coupling feature () at a lower surface of the second substrate (). The first plurality of layer includes a second EMI shielding layer (). The packaged IC further includes a functional die () disposed between the first () and the second () substrates and functionally coupled to the first () and/or the second () circuit coupling features. In the packaged IC, the adhesive material () electrically couples the first () and the second () shielding layers.