The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 10, 1998
Filed:
Apr. 26, 1996
Stanley C Beddingfield, Austin, TX (US);
Motorola, Inc., Schaumburg, IL (US);
Abstract
A semiconductor device (30) includes a bumped semiconductor die (32) having a plurality of input/output (I/O) bumps (36) and a plurality of alignment bumps (38). Alignment bumps (38) are formed at the same time as I/O bumps (36) and are used by a vision system to properly align die (32) to a mounting substrate (34) for attachment thereto. Because the alignment bumps are smaller than the I/O bumps, the alignment bumps are not damaged during manufacturing operations such as wafer probe, burn-in, or test, and therefore maintain their original shape. The vision system can thus use the alignment bumps to repeatedly and accurately align the die to the mounting substrate, thereby eliminating misalignment caused by damage to the I/O bumps.