Jie Chen

Title: Innovations of Jie Chen in Semiconductor Technology

Introduction

Jie Chen is a prominent inventor based in Denton, TX, known for his significant contributions to semiconductor technology. With a total of 12 patents to his name, he has made remarkable advancements in the field, particularly in high power GaN modules and semiconductor packaging.

Latest Patents

One of Jie Chen's latest patents is titled "Interconnect structure for high power GaN module including a printed planar interconnect line and method for making the same." This patent describes a circuit module featuring a multilayer substrate with a conductive pad. An integrated circuit (IC) die is bonded to the substrate in a dead bug manner, allowing a set of bond pads on the IC die to be exposed. A planar interconnect line, formed by printed ink, connects these bond pads to the conductive pad.

Another notable patent is "Passives to facilitate mold compound flow." This invention involves a semiconductor package that includes a substrate and multiple columns of semiconductor dies arranged in parallel along the substrate's length. The package also features multiple passive components positioned between the columns of semiconductor dies, angled between 30 and 60 degrees relative to the substrate. This design allows for mold compound flow through capillary action, enhancing the efficiency of the semiconductor package.

Career Highlights

Jie Chen is currently employed at Texas Instruments Corporation, where he continues to innovate and develop cutting-edge technologies in the semiconductor industry. His work has significantly impacted the efficiency and performance of semiconductor devices.

Collaborations

Throughout his career, Jie Chen has collaborated with talented individuals such as Rajen Manicon Murugan and Yiqi Tang. These collaborations have fostered a creative environment that has led to the development of groundbreaking technologies.

Conclusion

Jie Chen's contributions to semiconductor technology through his patents and collaborations highlight his role as a leading inventor in the field. His work continues to influence advancements in high power GaN modules and semiconductor packaging, showcasing the importance of innovation in technology.