The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 20, 2026

Filed:

Mar. 07, 2023
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Li Jiang, Allen, TX (US);

Jie Chen, Plano, TX (US);

Yutaka Suzuki, Allen, TX (US);

Rajen Murugan, Dallas, TX (US);

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10W 40/25 (2026.01); H10P 58/00 (2026.01); H10W 70/63 (2026.01); H10W 74/01 (2026.01); H10W 74/10 (2026.01); H10W 74/47 (2026.01); H10W 90/00 (2026.01); H10W 72/00 (2026.01); H10W 72/30 (2026.01); H10W 74/00 (2026.01);
U.S. Cl.
CPC ...
H10W 40/251 (2026.01); H10P 58/00 (2026.01); H10W 70/635 (2026.01); H10W 74/016 (2026.01); H10W 74/121 (2026.01); H10W 74/47 (2026.01); H10W 90/00 (2026.01); H10W 72/01321 (2026.01); H10W 72/0198 (2026.01); H10W 72/353 (2026.01); H10W 74/00 (2026.01); H10W 90/731 (2026.01); H10W 90/794 (2026.01);
Abstract

An electronic device includes: a semiconductor die having opposite first and second sides and a conductive terminal along the first side; a conductive lead electrically coupled to the conductive terminal; a package structure that forms a top side of the electronic device and encloses a portion of the semiconductor die, the package structure including a first molding compound having a first thermal conductivity; and a thermally conductive layer on at least a portion of the second side of the semiconductor die, the thermally conductive layer including a second molding compound having a second thermal conductivity that is greater than the first thermal conductivity.


Find Patent Forward Citations

Jiang, Li. (2026). Thermally enhanced package with high k mold compound on die top (U.S. Patent No. 12772843). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12772843

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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