The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 25, 2026

Filed:

Sep. 30, 2022
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Jie Chen, Plano, TX (US);

Rajen Maricon Murugan, Dallas, TX (US);

Chittranjan Mohan Gupta, Richardson, TX (US);

Yiqi Tang, Allen, TX (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H10W 44/20 (2026.01); H02M 1/44 (2007.01); H10D 1/20 (2025.01); H10D 86/80 (2025.01);
U.S. Cl.
CPC ...
H10W 44/20 (2026.01); H10W 44/206 (2026.01); H10W 44/216 (2026.01); H10W 44/248 (2026.01);
Abstract

An apparatus includes: a first conductor layer patterned into parallel strips having a first end and an opposite second end formed on a device side surface of a multilayer package substrate, the multilayer package substrate including conductor layers spaced from one another by dielectric material and coupled to one another by conductive vertical connection layers extending through the dielectric material; a second conductor layer in the multilayer package substrate spaced from the first conductor layer, the second conductor layer patterned into parallel strips having a first end and a second end, the second conductor layer coupled to the first conductor layer by vertical connectors formed of the conductive vertical connection layers at the first end and the second end, and a semiconductor die mounted to the device side surface of the multilayer package substrate that is spaced from and coupled to the second conductor.


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