The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 15, 2012
Filed:
May. 08, 2009
Rajiv Dunne, Murphy, TX (US);
Gary P. Morrison, Garland, TX (US);
Satyendra S. Chauhan, Dallas, TX (US);
Masood Murtuza, Sugarland, TX (US);
Thomas D. Bonifield, Dallas, TX (US);
Rajiv Dunne, Murphy, TX (US);
Gary P. Morrison, Garland, TX (US);
Satyendra S. Chauhan, Dallas, TX (US);
Masood Murtuza, Sugarland, TX (US);
Thomas D. Bonifield, Dallas, TX (US);
Texas Instruments Incorporated, Dallas, TX (US);
Abstract
A semiconductor device includes an integrated circuit (IC) die including a substrate, and at least one through substrate via (TSV) that extends through the substrate to a protruding integral tip that includes sidewalls and a distal end. The protruding integral tip has a tip height between 1 and 50 μm. A metal layer is on the bottom surface of the IC die, and the sidewalls and the distal end of the protruding integral tips. A semiconductor device can include an IC die that includes TSVs and a package substrate such as a lead-frame, where the IC die includes a metal layer and an electrically conductive die attach adhesive layer, such as a solder filled polymer wherein the solder is arranged in an electrically interconnected network, between the metal layer and the die pad of the lead-frame.