The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 01, 2011
Filed:
Feb. 04, 2009
Applicant:
Rajiv C Dunne, Murphy, TX (US);
Inventor:
Rajiv C Dunne, Murphy, TX (US);
Assignee:
Texas Instruments Incorporated, Dallas, TX (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor system having a substrate () including a rigid insulating interposer () with a high modulus and a top () and a bottom () low-modulus tape with flip-attached semiconductor chips (). The assembled chips, with the passive surfaces facing each other, are located in an opening () of the interposer, which has a thickness () equal to or smaller than the sum of the assembled two chips. Adhesive material () holds the tapes parallel to the interposer and the chip surfaces together. Solder balls () and discrete components () may be attached to the outside surfaces of the tapes.