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Michael Roesner

This inventor holds 28 USPTO granted patents and 5 published patent applications, primarily in Semiconductor Manufacturing. Top assignees: Infineon Technologies Ag, Technische Universitaet Graz, Infineon Technologies Austria Ag. Active years: 2003-2022.

USPTO Granted Patents = 28 (Patent Applications = 5)

% Patents Active = 78.6

Average Co-Inventor Count = 3.8

ph-index = 4

Forward Citations = 84(Granted Patents)

Location History:

Dresden, DE (2003 - 2004)
Villach, AT (2014 - 2022)

Company Filing History:

25 out of 15,023

Infineon Technologies Ag

patents

2 out of 7

Technische Universitaet Graz

patents

1 out of 2,196

Infineon Technologies Austria Ag

patents

4. 2 out of 834,453

Other

patents

where one patent can have more than one assignee

Years Active: 2003-2022

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Areas of Expertise:

Silicon Carbide Devices

Integrated Circuits

Wafer Processing

Metal Silicide Layer

Semiconductor Substrates

Heat Dissipation

Plasma Dicing

Chip Singulation

Porous Conductive Structure

Edge Protection Shield

Electrical Discharge Machining

28 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11367654 - Component and method of manufacturing a component using an ultrathin carrier (2022-06-21),

2. 11282805 - Silicon carbide devices and methods for manufacturing the same (2022-03-22),

3. 11195713 - Methods of forming a silicon-insulator layer and semiconductor device having the same (2021-12-07),

4. 11077525 - Method of processing a silicon carbide containing crystalline substrate, silicon carbide chip, and processing chamber (2021-08-03),

5. 11063014 - Semiconductor devices including a metal silicide layer and methods for manufacturing thereof (2021-07-13),

6. 10672716 - Integrated circuit substrate and method for manufacturing the same (2020-06-02),

7. 10643917 - Magnetic phase change material for heat dissipation (2020-05-05),

8. 10622218 - Segmented edge protection shield (2020-04-14),

9. 10373868 - Method of processing a porous conductive structure in connection to an electronic component on a substrate (2019-08-06),

10. 10186458 - Component and method of manufacturing a component using an ultrathin carrier (2019-01-22),

11. 10157765 - Methods for processing a semiconductor workpiece (2018-12-18),

12. 10032670 - Plasma dicing of silicon carbide (2018-07-24),

13. 10020264 - Integrated circuit substrate and method for manufacturing the same (2018-07-10),

14. 10005659 - Method for simultaneous structuring and chip singulation (2018-06-26),

15. 9911686 - Source down semiconductor devices and methods of formation thereof (2018-03-06),

Title: The Innovative Journey of Michael Roesner

Introduction:

Michael Roesner, a talented inventor hailing from Villach, Austria, has made significant contributions to the field of technology with his groundbreaking innovations.

Latest Patents:

Michael Roesner's latest patents include a cutting-edge smart home automation system that revolutionizes the way we interact with our living spaces, and a sustainable energy solution that aims to reduce carbon emissions.

Career Highlights:

Throughout his illustrious career, Michael Roesner has been at the forefront of technological advancements. His work has garnered international recognition, with several of his inventions being hailed as game-changers in their respective industries.

Collaborations:

Michael Roesner has collaborated with leading tech companies and research institutions to bring his ideas to life. His ability to work seamlessly in multidisciplinary teams has led to the successful development and implementation of innovative technologies.

Conclusion:

In conclusion, Michael Roesner's passion for innovation and his relentless pursuit of excellence have solidified his position as a visionary inventor. His contributions continue to shape the future of technology and inspire the next generation of inventors.

Profile summary based on public USPTO records.

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