The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 05, 2020
Filed:
Sep. 21, 2018
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Michael Roesner, Villach, AT;
Christoph Bergmann, Villach, AT;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 21/44 (2006.01); H01L 21/48 (2006.01); H01L 21/50 (2006.01); H01L 23/29 (2006.01); H01L 23/427 (2006.01); H01L 23/433 (2006.01); H01L 43/02 (2006.01); H01L 43/10 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/34 (2013.01); H01L 23/29 (2013.01); H01L 23/295 (2013.01); H01L 23/427 (2013.01); H01L 23/4334 (2013.01); H01L 43/02 (2013.01); H01L 43/10 (2013.01); H01L 23/3107 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73265 (2013.01);
Abstract
An electronic component includes an electronic chip and a magnetic phase change material configured to consume energy when changing between different magnetic phases in response to heating above a phase change temperature. The phase change material is thermally coupled with the electronic chip to thereby dissipate heat from the electronic chip upon heating up to or above the phase change temperature.