The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 10, 2018
Filed:
Apr. 28, 2015
Infineon Technologies Ag, Neubiberg, DE;
Michael Roesner, Villach, AT;
Gudrun Stranzl, Gödersdorf, AT;
Manfred Engelhardt, Villach-Landskron, AT;
Martin Zgaga, Rosegg, AT;
Infineon Technologies AG, Neubiberg, DE;
Abstract
The description discloses a method for use in manufacturing integrated circuit chips. The method comprises providing a wafer having a plurality of integrated circuits each provided in an separate active areas, and, for each active area, outside the active area, providing a code pattern that is associated with the integrated circuit. A computer-readable medium is also disclosed. Further, a manufacturing apparatus configured to receive a wafer and to remove material from the wafer so as to provide a scribe line to the wafer formed as a trench for use in separation of the wafer into dies is also disclosed. The description also discloses a wafer, an integrated circuit chip die substrate originating from a wafer of origin and carrying an integrated circuit, and an integrated circuit chip.