The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 02, 2020
Filed:
Jul. 09, 2018
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Michael Roesner, Villach, AT;
Gudrun Stranzl, Gödersdorf, AT;
Manfred Engelhardt, Villach-Landskron, AT;
Martin Zgaga, Rosegg, AT;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/544 (2006.01); H01L 21/78 (2006.01); H01L 21/3065 (2006.01);
U.S. Cl.
CPC ...
H01L 23/544 (2013.01); H01L 21/30655 (2013.01); H01L 21/78 (2013.01); H01L 2223/5446 (2013.01); H01L 2223/54413 (2013.01); H01L 2223/54433 (2013.01); H01L 2223/54473 (2013.01);
Abstract
An integrated circuit substrate and a method for manufacturing the same are disclosed. In an embodiment a method includes providing a wafer having a plurality of active areas, each active area being provided in a separate die area and for each active area, providing a code pattern outside the active area, the code pattern being associated with the die area.