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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10157765 B1

PDFFull Text
Date of Patent:
Dec. 18, 2018

Filed:

Nov. 23, 2016

Methods for processing a semiconductor workpiece

Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Gudrun Stranzl, Goedersdorf, AT;

Martin Zgaga, Rosegg, AT;

Rainer Leuschner, Regensburg, DE;

Bernhard Goller, Villach, AT;

Bernhard Boche, Munich, DE;

Manfred Engelhardt, Villach-Landskron, AT;

Hermann Wendt, Regensburg, DE;

Bernd Noehammer, Villach, AT;

Karl Mayer, Villach, AT;

Michael Roesner, Villach, AT;

Monika Cornelia Voerckel, Villach, AT;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:

Viering, Jentschura & Partner MBB

Primary Examiner:

Sophia Nguyen

Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 21/683 (2006.01); H01L 21/283 (2006.01); H01L 21/78 (2006.01); H01L 21/033 (2006.01); H01L 21/285 (2006.01); H01L 21/304 (2006.01); H01L 21/3065 (2006.01); H01L 21/308 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6835 (2013.01); H01L 21/0331 (2013.01); H01L 21/283 (2013.01); H01L 21/2855 (2013.01); H01L 21/304 (2013.01); H01L 21/3065 (2013.01); H01L 21/3081 (2013.01); H01L 21/3086 (2013.01); H01L 21/6836 (2013.01); H01L 21/76895 (2013.01); H01L 21/78 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68359 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/13055 (2013.01);
Abstract

Methods for processing a semiconductor workpiece can include providing a semiconductor workpiece that includes one or more kerf regions; forming one or more trenches in the workpiece by removing material from the one or more kerf regions from a first side of the workpiece; mounting the workpiece with the first side to a carrier; thinning the workpiece from a second side of the workpiece; and forming a metallization layer over the second side of the workpiece.

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