Sunnyvale, CA, United States of America

Ling Chen

USPTO Granted Patents = 101 

Average Co-Inventor Count = 3.6

ph-index = 40

Forward Citations = 7,206(Granted Patents)

DiyaCoin DiyaCoin 1.33 


Inventors with similar research interests:


Location History:

  • Fremont, CA (US) (2010 - 2012)
  • Sunnyvale, CA (US) (1993 - 2014)

Company Filing History:


Years Active: 1993-2014

where 'Filed Patents' based on already Granted Patents

101 patents (USPTO):

Title: Ling Chen: Innovating Thin Layer Deposition and High-Performance Interconnects

Introduction:

In the realm of thin layer deposition and high-performance interconnects, Ling Chen stands out as a prominent inventor and contributor. Based in Sunnyvale, CA, Ling has made significant strides in advancing semiconductor manufacturing processes. Currently working at Applied Materials, Inc., Ling has accumulated an impressive portfolio of patents and continues to drive innovation in the field.

Latest Patents:

Ling Chen's latest patents showcase his expertise in gas delivery apparatus and methods for atomic layer deposition, as well as enhanced copper growth with ultrathin barrier layers for high-performance interconnects. These patented inventions highlight his commitment to optimizing manufacturing processes for superior performance and efficiency.

Gas Delivery Apparatus and Method for Atomic Layer Deposition:

This patent introduces a novel gas delivery assembly within a processing chamber. The lid, comprising a cap portion and a covering member, incorporates an expanding channel, optimizing gas flow during deposition processes. Ling's design ensures uniform gas distribution, enhancing the consistency and quality of deposited thin layers.

Enhanced Copper Growth with Ultrathin Barrier Layer for High-Performance Interconnects:

Ling's invention addresses the challenge of depositing a refractory metal nitride barrier layer of no more than 20 angstroms. By introducing a pulse of a metal-containing compound followed by a pulse of a nitrogen-containing compound, Ling enables thorough grain growth between metal layers. This breakthrough enhances the electrical performance of interconnects, paving the way for faster and more efficient integrated circuits.

Career Highlights:

Throughout his career, Ling Chen has become renowned for his contributions in semiconductor manufacturing. His work at Applied Materials, Inc., a leading semiconductor equipment and solutions provider, has allowed him to further his expertise and contribute to cutting-edge advancements in the industry. With an astounding 101 patents to his name, Ling's dedication and innovation continue to shape the field.

Collaborations:

Among Ling's accomplished colleagues is Hua Chung, who has also made significant contributions to the field of semiconductor manufacturing. Collaborations with experts like Hua Chung enable Ling to leverage collective knowledge and design integrated solutions that push the boundaries of innovation in the industry.

Conclusion:

Ling Chen's undeniable talent, expertise, and inventive spirit position him as a key player in the realm of thin layer deposition and high-performance interconnects. From enhancing gas delivery in atomic layer deposition to optimizing copper growth with ultrathin barrier layers, Ling's patents highlight his commitment to advancing semiconductor manufacturing processes. Ling's collaboration with esteemed professionals such as Hua Chung reinforces his dedication to leveraging collective knowledge for groundbreaking advancements. As Ling continues his journey as an innovator, the industry eagerly awaits his next wave of pioneering inventions.

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