The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 06, 2011
Filed:
Aug. 20, 2009
Ling Chen, Sunnyvale, CA (US);
Vincent W. Ku, San Jose, CA (US);
Mei Chang, Saratoga, CA (US);
Dien-yeh Wu, San Jose, CA (US);
Hua Chung, San Jose, CA (US);
Ling Chen, Sunnyvale, CA (US);
Vincent W. Ku, San Jose, CA (US);
Mei Chang, Saratoga, CA (US);
Dien-Yeh Wu, San Jose, CA (US);
Hua Chung, San Jose, CA (US);
Applied Materials, Inc., Santa Clara, CA (US);
Abstract
In one embodiment, an apparatus for performing an atomic layer deposition (ALD) process is provided which includes a chamber body containing a substrate support, a lid assembly attached to the chamber body, a remote plasma system (RPS) in fluid communication with the reaction zone, a centralized expanding conduit extending through the lid assembly and expanding radially outwards, a first gas delivery sub-assembly configured to deliver a first process gas, and a second gas delivery sub-assembly configured to deliver a second process gas into the centralized expanding conduit. The first gas delivery sub-assembly contains an annular channel encircling and in fluid communication with the centralized expanding conduit, wherein the annular channel is adapted to deliver the first process gas through a plurality of passageways and nozzles and into the centralized expanding conduit. The second gas delivery sub-assembly contains a gas inlet in fluid communication to the centralized expanding conduit.