Tokyo, Japan

Kazuyuki Mitsukura

This inventor holds 19 USPTO granted patents and 33 published patent applications and 1 EPO patent, primarily in Semiconductor Packaging. Top assignees: Hitachi Chemical Company, Ltd., Resonac Corporation, Showa Denko Materials Co., Ltd.. Active years: 2012-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kazuyuki Mitsukura. Retrieved from https://idiyas.com/inventor/kazuyuki-mitsukura

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 19 

% Patents Active = 78.9

 

Average Co-Inventor Count = 3.9

ph-index = 2

Forward Citations = 26(Granted Patents)


Location History:

  • Ibaraki, JP (2013)
  • Tsukuba, JP (2012 - 2019)
  • Tokyo, JP (2019 - 2024)

Company Filing History:


Years Active: 2012-2026

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Areas of Expertise:
Organic Core Material
Wiring Board
Semiconductor Package
Photosensitive Resin
Layered Plate
Wiring Structure
Organic Interposer
Resin Composition
Semiconductor Device
Film Adhesive
Adhesive Sheet
Patterned Adhesive
19 patents (USPTO):Explore Patents

Title: **The Innovations of Kazuyuki Mitsukura: A Pioneer in Semiconductor and Wiring Technologies**

Introduction

Kazuyuki Mitsukura is a prominent inventor located in Tokyo, Japan, known for his contributions to the fields of semiconductor technology and wiring structures. With a commendable portfolio of 13 patents, Mitsukura continues to push the boundaries of innovation and engineering.

Latest Patents

Among his latest patents, two notable inventions include a wiring structure along with a method for manufacturing the same, and a semiconductor package. The first patent discloses a method for manufacturing a wiring structure that involves several critical steps. This method includes forming a modified region with pores on an insulating resin layer's surface through surface modification, creating a seed layer by sputtering, and subsequently applying electrolytic copper plating to form the wiring.

His second patent details a wiring board with a first insulating material layer exhibiting an arithmetic average roughness (Ra) of 100 nm or less. This innovative wiring board features metal wiring on the surface of the first insulating layer, which is covered by a second insulating material layer. The construction involves a metal layer directly in contact with the surface of the first insulating layer and a conductive part stacked atop the metal layer. Notably, the nickel content rate in the metal layer ranges from 0.25 to 20% by mass.

Career Highlights

Kazuyuki Mitsukura has had a distinguished career, contributing his talents to several reputable companies. He has worked at Hitachi Chemical Company, Limited, where he focused on high-performance materials, and Resonac Corporation, known for its advancements in materials science. His work reflects his commitment to engineering excellence and innovation.

Collaborations

Throughout his career, Mitsukura has collaborated with esteemed colleagues, including Masaya Toba and Kazuhiko Kurafuchi. These partnerships highlight the importance of teamwork in driving innovation and advancing technology.

Conclusion

Kazuyuki Mitsukura's significant contributions to the fields of wiring and semiconductor technologies have solidified his position as an influential inventor. With a solid foundation of patents and collaborations across esteemed organizations, he represents the spirit of innovation in modern engineering, continually shaping the future of technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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