The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 01, 2019
Filed:
Jul. 16, 2013
Applicant:
Hitachi Chemical Company, Ltd., Tokyo, JP;
Inventors:
Tomonori Minegishi, Tsukuba, JP;
Kazuyuki Mitsukura, Tsukuba, JP;
Assignee:
Hitachi Chemical Company, Ltd, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 179/08 (2006.01); G03F 7/027 (2006.01); G03F 7/037 (2006.01); G03F 7/038 (2006.01); G03F 7/075 (2006.01); H01L 23/00 (2006.01); C09J 7/20 (2018.01);
U.S. Cl.
CPC ...
C09J 179/08 (2013.01); C09J 7/20 (2018.01); G03F 7/027 (2013.01); G03F 7/037 (2013.01); G03F 7/038 (2013.01); G03F 7/0387 (2013.01); G03F 7/0751 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 24/92 (2013.01); C09J 2201/122 (2013.01); C09J 2203/326 (2013.01); C09J 2205/31 (2013.01); C09J 2479/08 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/94 (2013.01); H01L 2224/1132 (2013.01); H01L 2224/1141 (2013.01); H01L 2224/1148 (2013.01); H01L 2224/131 (2013.01); H01L 2224/1329 (2013.01); H01L 2224/1339 (2013.01); H01L 2224/13139 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13155 (2013.01); H01L 2224/13164 (2013.01); H01L 2224/13169 (2013.01); H01L 2224/13187 (2013.01); H01L 2224/13339 (2013.01); H01L 2224/13344 (2013.01); H01L 2224/13347 (2013.01); H01L 2224/13355 (2013.01); H01L 2224/13364 (2013.01); H01L 2224/13369 (2013.01); H01L 2224/13387 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/271 (2013.01); H01L 2224/27003 (2013.01); H01L 2224/27436 (2013.01); H01L 2224/27515 (2013.01); H01L 2224/27618 (2013.01); H01L 2224/27848 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/2939 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/29344 (2013.01); H01L 2224/29347 (2013.01); H01L 2224/29355 (2013.01); H01L 2224/29387 (2013.01); H01L 2224/29391 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73104 (2013.01); H01L 2224/81002 (2013.01); H01L 2224/81203 (2013.01); H01L 2224/83002 (2013.01); H01L 2224/83203 (2013.01); H01L 2224/83855 (2013.01); H01L 2224/83856 (2013.01); H01L 2224/83862 (2013.01); H01L 2224/92 (2013.01); H01L 2224/9211 (2013.01); H01L 2224/94 (2013.01);
Abstract
The present invention provides a photosensitive resin composition comprising: an alkali-soluble resin having a phenolic hydroxyl group as an end group (A); a radiation-polymerizable compound (B); and a photoinitiator (C), a film adhesive, an adhesive sheet, an adhesive pattern, a semiconductor wafer with an adhesive layer, and a semiconductor device using the photosensitive resin composition.