The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 04, 2024

Filed:

Dec. 19, 2019
Applicant:

Showa Denko Materials Co., Ltd., Tokyo, JP;

Inventors:

Masaya Toba, Tokyo, JP;

Kazuhiko Kurafuchi, Tokyo, JP;

Takashi Masuko, Tokyo, JP;

Kazuyuki Mitsukura, Tokyo, JP;

Shinichiro Abe, Tokyo, JP;

Assignee:

RESONAC CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/00 (2006.01); C23C 18/16 (2006.01); C23C 18/20 (2006.01); C23C 18/32 (2006.01); C23C 18/38 (2006.01); H05K 1/03 (2006.01); H05K 3/18 (2006.01);
U.S. Cl.
CPC ...
H05K 3/181 (2013.01); C23C 18/1605 (2013.01); C23C 18/165 (2013.01); C23C 18/20 (2013.01); C23C 18/32 (2013.01); C23C 18/38 (2013.01); H05K 1/032 (2013.01); H05K 2201/068 (2013.01);
Abstract

A wiring board according to the present disclosure includes a first insulating material layer having a surface with an arithmetic average roughness Ra of 100 nm or less, a metal wiring provided on the surface of the first insulating material layer, and a second insulating material layer provided to cover the metal wiring, in which the metal wiring is configured by a metal layer in contact with the surface of the first insulating material layer and a conductive part stacked on a surface of the metal layer, and a nickel content rate of the metal layer is 0.25 to 20% by mass.


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