The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 16, 2026
Filed:
Sep. 09, 2021
Resonac Corporation, Tokyo, JP;
Kei Togasaki, Tokyo, JP;
Kenichi Iwashita, Tokyo, JP;
Keishi Ono, Tokyo, JP;
Mao Narita, Tokyo, JP;
Kazuyuki Mitsukura, Tokyo, JP;
Masaya Toba, Tokyo, JP;
Abstract
A method for producing a wiring board, including: a step of pretreating the surface of a metal layer exposed into an opening by bringing the surface into contact with a pretreatment liquid at a predetermined pretreatment temperature; and a step of forming a copper plating layer on the metal layer by electrolytic plating. The resist layer and the pretreatment liquid are selected such that a mass change rate of the resist layer when the resist layer before being exposed and developed is immersed in the pretreatment liquid is −2.0% by mass or more. The mass change rate is a value calculated by Expression: Mass change rate (% by mass)={(W1−W0)/W0}×100. W1 is the mass of the resist layer after a laminated body including a resist layerand a copper foil is immersed in the pretreatment liquid at the pretreatment temperature for 30 minutes.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile