Tokyo, Japan

Mao Narita

This inventor holds 2 USPTO granted patents and 13 published patent applications. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Mao Narita. Retrieved from https://idiyas.com/inventor/mao-narita

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 2 

% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 1


Years Active: 2026

Loading Chart...
2 patents (USPTO):Explore Patents

Title: Mao Narita: Innovator in Wiring Board Technology

Introduction

Mao Narita is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of wiring board technology, holding a total of 2 patents. His innovative methods have advanced the manufacturing processes in this critical area of electronics.

Latest Patents

Narita's latest patents include a method for producing a wiring board and a method for manufacturing a wiring board. The first patent outlines a process that involves pretreating the surface of a metal layer exposed in an opening by bringing it into contact with a pretreatment liquid at a predetermined temperature. This is followed by forming a copper plating layer on the metal layer through electrolytic plating. The resist layer and pretreatment liquid are carefully selected to achieve a mass change rate of the resist layer of −2.0% by mass or more. The mass change rate is calculated using a specific formula that considers the mass of the resist layer before and after immersion in the pretreatment liquid.

The second patent details a method for manufacturing a wiring board that includes forming a resist layer on a seed layer made of metal on a support body. This process involves creating a pattern with an opening in the resist layer through light exposure and development, followed by the formation of a copper plating layer on the exposed seed layer using electrolytic plating. The surface roughness of the seed layer is also specified to be between 0.05 μm and 0.30 μm.

Career Highlights

Mao Narita has established himself as a key figure in the development of advanced wiring board technologies. His innovative approaches have not only improved manufacturing efficiency but have also enhanced the quality of the final products.

Collaborations

Narita has collaborated with notable colleagues, including Keishi Ono and Kei Togasaki, to further advance the field of wiring board technology. Their combined expertise has contributed to the successful development of new methods and processes.

Conclusion

Mao Narita's contributions to wiring board technology through his innovative patents demonstrate his commitment to advancing the field. His work continues to influence the electronics industry, paving the way for future innovations.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…