The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 09, 2026
Filed:
Jul. 29, 2022
Resonac Corporation, Tokyo, JP;
Kei Togasaki, Tokyo, JP;
Kazuyuki Mitsukura, Tokyo, JP;
Masaya Toba, Tokyo, JP;
Kenichi Iwashita, Tokyo, JP;
Keishi Ono, Tokyo, JP;
Mao Narita, Tokyo, JP;
Abstract
A method for manufacturing a wiring board, including: forming a resist layer on a seed layer comprising a metal provided on a support body; forming a pattern including an opening to which the seed layer is exposed in the resist layer by light exposure and development of the resist layer; and forming a copper plating layer on the seed layer exposed into the opening by electrolytic plating, in this order. The arithmetic mean roughness Ra of the surface of the seed layer on a side opposite to the support body is 0.05 μm or more and 0.30 μm or less.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile