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Showa Denko Materials Co., Ltd.

USPTO Granted Patents = 139

EPO Patents = 33

Trademarks = 12

Forward Citations = 58

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270 inventors (with patents filed for the assignee):

Yoshitaka Takezawa (14 out of 46 patents)

Tomohiro Iwano (10 out of 41 patents)

Yoshinori Ejiri (9 out of 27 patents)

4. Tomoko Higashiuchi (9 out of 19 patents)

5. Naoki Maruyama (8 out of 79 patents)

6. Kazumasa Fukuda (8 out of 56 patents)

7. Yuka Yoshida (8 out of 17 patents)

8. Hikari Murai (7 out of 36 patents)

9. Takao Tanigawa (7 out of 13 patents)

10. Yuki Kawana (7 out of 14 patents)

11. Hideo Nakako (7 out of 22 patents)

12. Dai Ishikawa (7 out of 44 patents)

13. Chie Sugama (7 out of 12 patents)

14. Hideyuki Katagi (7 out of 13 patents)

15. Tetsuyuki Shirakawa (6 out of 9 patents)

Core Competencies:

Epoxy Resin

Electroconductive Film

Lithium Ion Battery

Polishing Liquid

Thermoelectric Module

Organic Interposer

Thermal Conduction Sheet

Semiconductor Device

Heat Storage Material

Electrochemical Device

FRP Precursor

Adhesive Composition

139 patents: Sort by Forward Citations

1. 12049538 - Epoxy resin, epoxy resin composition, epoxy resin cured product and composite material (2024-07-30),

2. 11667817 - Electroconductive film, roll, connected structure, and process for producing connected structure (2023-06-06),

3. 11624016 - Moisture-curable reactive hot-melt adhesive composition and method for producing the same (2023-04-11),

4. 11608455 - Adhesive for semiconductor device, and high productivity method for manufacturing said device (2023-03-21),

5. 11605818 - Anode material for lithium ion secondary battery, method of producing anode material for lithium ion secondary battery, anode for lithium ion secondary battery, and lithium ion secondary battery (2023-03-14),

6. 11584868 - Polishing liquid and polishing method (2023-02-21),

7. 11581212 - Prepreg for coreless substrate, coreless substrate and semiconductor package (2023-02-14),

8. 11578236 - Slurry, polishing-liquid set, polishing liquid, and polishing method for base (2023-02-14),

9. 11575076 - Method for manufacturing thermoelectric conversion module, thermoelectric conversion module, and binder for thermoelectric conversion module (2023-02-07),

10. 11572490 - Polishing liquid, polishing liquid set, and polishing method (2023-02-07),

11. 11566150 - Slurry and polishing method (2023-01-31),

12. 11562951 - Organic interposer and method for manufacturing organic interposer (2023-01-24),

13. 11560476 - Epoxy resin, epoxy resin composition, epoxy resin cured product, and composite material (2023-01-24),

14. 11553593 - Resin film for interlayer insulating layer with support, multilayer printed circuit board, and method of manufacturing multilayer printed circuit board (2023-01-10),

15. 11545413 - Thermal conduction sheet and heat dissipating device including thermal conduction sheet (2023-01-03),

Showa Denko Materials Co., Ltd. is a leading manufacturer of Electronic Packaging Materials, offering a wide range of products such as epoxy molding compounds, semiconductor encapsulation materials, and high-purity aluminum foil. With cutting-edge technologies and innovative solutions, Showa Denko Materials provides high-quality materials that contribute to the development of various industries including semiconductor, electronics, and automotive. For more information, please visit their website.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 30 2025

139 Patents

#389 in Tokyo

#876 in Japan

#5,675 in the World

Showa Denko Materials Co., Ltd.

Forward Citations = 58

270 inventors:

Yoshitaka Takezawa (14 out of 46 patents)

Tomohiro Iwano (10 out of 41 patents)

Yoshinori Ejiri (9 out of 27 patents)

4. Tomoko Higashiuchi (9 out of 19 patents)

5. Naoki Maruyama (8 out of 79 patents)

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