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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11667817 B1

PDFFull Text
Date of Patent:
Jun. 06, 2023

Filed:

Sep. 26, 2017

Electroconductive film, roll, connected structure, and process for producing connected structure

Applicant:

Hitachi Chemical Company, Ltd., Tokyo, JP;

Inventors:

Takashi Tatsuzawa, Tokyo, JP;

Kazuya Matsuda, Tokyo, JP;

Yutaka Tsuchida, Tokyo, JP;

Takashi Seki, Tokyo, JP;

Mitsuyoshi Shimamura, Tokyo, JP;

Kengo Shinohara, Tokyo, JP;

Tetsuyuki Shirakawa, Tokyo, JP;

Yasunori Kawabata, Tokyo, JP;

Satoru Matsumoto, Tokyo, JP;

Assignee:

Showa Denko Materials Co., Ltd., Tokyo, JP;

Attorney:

Fitch, Even, Tabin & Flannery, LLP

Primary Examiner:

Fernando L Toledo

Assistant Examiner:

Valerie N Newton

Int. Cl.
CPC ...
H01L 21/68 (2006.01); C09J 9/02 (2006.01); C09J 7/00 (2018.01); C09J 7/30 (2018.01); C09J 7/40 (2018.01); C09J 11/04 (2006.01); C09J 201/00 (2006.01); H01B 1/22 (2006.01); H01B 5/14 (2006.01); H01B 5/16 (2006.01); H01L 23/00 (2006.01); H01R 11/01 (2006.01);
U.S. Cl.
CPC ...
C09J 9/02 (2013.01); C09J 7/00 (2013.01); C09J 7/30 (2018.01); C09J 7/401 (2018.01); C09J 11/04 (2013.01); C09J 201/00 (2013.01); H01B 1/22 (2013.01); H01B 5/14 (2013.01); H01B 5/16 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 24/83 (2013.01); H01R 11/01 (2013.01); C09J 2203/326 (2013.01); C09J 2423/045 (2013.01); C09J 2423/105 (2013.01); C09J 2425/00 (2013.01); C09J 2463/00 (2013.01); C09J 2467/005 (2013.01); H01L 24/32 (2013.01); H01L 2224/2711 (2013.01); H01L 2224/27334 (2013.01); H01L 2224/29012 (2013.01); H01L 2224/29013 (2013.01); H01L 2224/29014 (2013.01); H01L 2224/29239 (2013.01); H01L 2224/29244 (2013.01); H01L 2224/29247 (2013.01); H01L 2224/29255 (2013.01); H01L 2224/29264 (2013.01); H01L 2224/29293 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32227 (2013.01); H01L 2224/743 (2013.01); H01L 2224/83121 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/83851 (2013.01); H01L 2224/97 (2013.01);
Abstract

A conductive film includes an elongated release film and a plurality of conductive adhesive film pieces provided on the release film. Then, the plurality of adhesive film pieces are arranged in a longitudinal direction X of the release film. For this reason, the adhesive film piece can be set to an arbitrary shape. Accordingly, it is possible to attach the adhesive film piece to adhesive surfaces having various shapes and to efficiently use the adhesive film piece.

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