Yuki Kawana

Title: Yuki Kawana: Innovator in Electronic Component Manufacturing

Introduction

Yuki Kawana is a prominent inventor based in Tokyo, Japan, known for his significant contributions to the field of electronic component manufacturing. With a total of 14 patents to his name, Kawana has developed innovative methods that enhance the production and functionality of electronic components.

Latest Patents

Kawana's latest patents include a method for producing a substrate having through-silicon vias, which involves several steps. The process begins with preparing a silicon substrate that has through-holes connecting both principal surfaces. Next, a copper sintered body is formed to fill these through-holes, followed by impregnating the copper body with a curable resin composition. The final step involves curing the resin to create an electric conductor that incorporates the copper sintered body. Another notable patent is related to a method for manufacturing an electronic component, which includes applying a metal paste onto a polymer compact, sintering the metal particles, and forming a solder layer that bonds the metal wiring to an electronic element.

Career Highlights

Throughout his career, Yuki Kawana has worked with notable companies such as Showa Denko Materials Co., Ltd. and Resonac Corporation. His work has significantly impacted the development of advanced electronic components, showcasing his expertise in the field.

Collaborations

Kawana has collaborated with several professionals, including Hideo Nakako and Yoshinori Ejiri, who have contributed to his innovative projects and research.

Conclusion

Yuki Kawana's contributions to electronic component manufacturing through his patents and collaborations highlight his role as a leading inventor in the industry. His innovative methods continue to influence the development of advanced technologies in electronics.