The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 04, 2022
Filed:
Jan. 18, 2018
Applicant:
Hitachi Chemical Company, Ltd., Tokyo, JP;
Inventors:
Yuki Kawana, Tokyo, JP;
Hideo Nakako, Tokyo, JP;
Motohiro Negishi, Tokyo, JP;
Dai Ishikawa, Tokyo, JP;
Chie Sugama, Tokyo, JP;
Yoshinori Ejiri, Tokyo, JP;
Assignee:
Showa Denko Materials Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 23/00 (2006.01); B22F 7/06 (2006.01); B22F 1/068 (2022.01); B22F 1/107 (2022.01);
U.S. Cl.
CPC ...
H01L 24/29 (2013.01); B22F 1/068 (2022.01); B22F 1/107 (2022.01); B22F 7/062 (2013.01); H01L 24/83 (2013.01); B22F 2301/10 (2013.01); B22F 2301/255 (2013.01); B22F 2301/30 (2013.01); H01L 2224/2926 (2013.01); H01L 2224/2928 (2013.01); H01L 2224/29211 (2013.01); H01L 2224/29216 (2013.01); H01L 2224/29218 (2013.01); H01L 2224/29224 (2013.01); H01L 2224/29239 (2013.01); H01L 2224/29244 (2013.01); H01L 2224/29247 (2013.01); H01L 2224/29249 (2013.01); H01L 2224/29255 (2013.01); H01L 2224/29257 (2013.01); H01L 2224/29264 (2013.01); H01L 2224/29266 (2013.01); H01L 2224/29269 (2013.01); H01L 2224/29271 (2013.01); H01L 2224/29347 (2013.01); H01L 2224/3226 (2013.01); H01L 2224/8384 (2013.01); H01L 2924/0103 (2013.01); H01L 2924/01004 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01022 (2013.01); H01L 2924/01024 (2013.01); H01L 2924/01025 (2013.01); H01L 2924/01026 (2013.01); H01L 2924/01027 (2013.01); H01L 2924/01028 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01042 (2013.01); H01L 2924/01046 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01);
Abstract
Provided is a metal paste for joints, containing: metal particles; and linear or branched monovalent aliphatic alcohol having 1 to 20 carbon atoms, in which the metal particles include sub-micro copper particles having a volume average particle diameter of 0.12 μm to 0.8 μM.