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For the Inventor, By the Inventor

Tokyo, Japan

Hideo Nakako

This inventor holds 24 USPTO granted patents and 10 published patent applications and 7 EPO patents, primarily in Copper Paste Technology. Top assignees: Hitachi Chemical Company, Ltd., Resonac Corporation, Showa Denko Materials Co., Ltd.. Active years: 2014-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hideo Nakako. Retrieved from https://idiyas.com/inventor/hideo-nakako

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 24 

% Patents Active = 87.5

 

Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 9(Granted Patents)


Location History:

  • Ibaraki, JP (2017)
  • Tsukuba, JP (2014 - 2019)
  • Tokyo, JP (2019 - 2024)

Company Filing History:

goldMedal10 out of 1,641 
 
Hitachi Chemical Company, Ltd.
 patents
silverMedal7 out of 401 
 
Resonac Corporation
 patents
bronzeMedal7 out of 139 
 
Showa Denko Materials Co., Ltd.
 patents

Years Active: 2014-2026

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Areas of Expertise:
Copper Paste
Semiconductor Device
Heat Pipe
Thermoelectric Module
Through-Silicon Via
Metal Paste
Bonding Material
Conductive Substrate
Adhesive Composition
Wick Formation
Etching Material
Copper Conductor Film
24 patents (USPTO):Explore Patents
1. 12564879 - Copper paste for joining, method for manufacturing joined body, and joined body (2026-03-03),
2. 12544832 - Copper paste, wick formation method, and heat pipe (2026-02-10),
3. 12354914 - Method for producing substrate having through-silicon vias, substrate having through-silicon vias, and copper paste for through-silicon via formation (2025-07-08),
4. 12233460 - Copper paste, wick formation method, and heat pipe (2025-02-25),
5. 12070800 - Electronic component and method for manufacturing electronic component (2024-08-27),
6. 11890681 - Method for producing bonded object and semiconductor device and copper bonding paste (2024-02-06),
7. 11887960 - Member connection method (2024-01-30),
8. 11575076 - Method for manufacturing thermoelectric conversion module, thermoelectric conversion module, and binder for thermoelectric conversion module (2023-02-07),
9. 11532588 - Copper paste for pressureless bonding, bonded body and semiconductor device (2022-12-20),
10. 11483936 - Method for producing joined body, and joining material (2022-10-25),
11. 11462502 - Metal paste for joints, assembly, production method for assembly, semiconductor device, and production method for semiconductor device (2022-10-04),
12. 11370066 - Metal paste for joints, assembly, production method for assembly, semiconductor device, and production method for semiconductor device (2022-06-28),
13. 11040416 - Copper paste for joining, method for manufacturing joined body, and method for manufacturing semiconductor device (2021-06-22),
14. 10930612 - Copper paste for pressureless bonding, bonded body and semiconductor device (2021-02-23),
15. 10748865 - Copper paste for joining, method for manufacturing joined body, and method for manufacturing semiconductor device (2020-08-18),

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Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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