The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 27, 2024
Filed:
Sep. 05, 2019
Showa Denko Materials Co., Ltd., Tokyo, JP;
Yoshinori Ejiri, Tokyo, JP;
Shinichirou Sukata, Tokyo, JP;
Masaya Toba, Tokyo, JP;
Hideo Nakako, Tokyo, JP;
Yuki Kawana, Tokyo, JP;
Kosuke Urashima, Tokyo, JP;
Motoki Yonekura, Tokyo, JP;
Takaaki Nohdoh, Tokyo, JP;
Yoshiaki Kurihara, Tokyo, JP;
Hiroshi Masuda, Tokyo, JP;
Keita Sone, Tokyo, JP;
RESONAC CORPORATION, Tokyo, JP;
Abstract
One aspect of the present invention is a method for manufacturing an electronic component, the method including: a first step of applying a metal paste containing metal particles onto a polymer compact in a prescribed pattern to form a metal paste layer; a second step of sintering the metal particles to form metal wiring; a third step of applying a solder paste containing solder particles and a resin component onto the metal wiring to form a solder paste layer; a fourth step of disposing an electronic element on the solder paste layer; and a fifth step of heating the solder paste layer so as to form a solder layer bonding the metal wiring and the electronic element, and so as to form a resin layer covering at least a portion of the solder layer.