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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10363608 B1

PDFFull Text
Date of Patent:
Jul. 30, 2019

Filed:

Sep. 07, 2016

Copper paste for joining, method for producing joined body, and method for producing semiconductor device

Applicant:

Hitachi Chemical Company, Ltd., Tokyo, JP;

Inventors:

Yuki Kawana, Tokyo, JP;

Kazuhiko Kurafuchi, Tokyo, JP;

Yoshinori Ejiri, Tokyo, JP;

Hideo Nakako, Tokyo, JP;

Chie Sugama, Tokyo, JP;

Dai Ishikawa, Tokyo, JP;

Assignee:

HITACHI CHEMICAL COMPANY, LTD., Tokyo, JP;

Attorney:

Fitch, Even, Tabin & Flannery, LLP

Primary Examiner:

Ida M Soward

Int. Cl.
CPC ...
H01L 21/52 (2006.01); B22F 7/08 (2006.01); B22F 1/00 (2006.01); C04B 37/00 (2006.01); H01B 1/22 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
B22F 7/08 (2013.01); B22F 1/00 (2013.01); B22F 1/0018 (2013.01); B22F 1/0055 (2013.01); C04B 37/00 (2013.01); H01B 1/22 (2013.01); H01L 21/52 (2013.01); H01L 24/27 (2013.01); H01L 24/32 (2013.01); B22F 2001/0033 (2013.01); B22F 2301/10 (2013.01); B22F 2304/056 (2013.01); B22F 2304/058 (2013.01); B22F 2304/10 (2013.01); B22F 2998/00 (2013.01); H01L 2224/33 (2013.01); H01L 2224/371 (2013.01); H01L 2224/40137 (2013.01); H01L 2224/40225 (2013.01); H01L 2224/40245 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/181 (2013.01);
Abstract

Provided is copper paste for joining including metal particles, and a dispersion medium. The metal particles include sub-micro copper particles having a volume-average particle size of 0.12 μm to 0.8 μm, and micro copper particles having a volume-average particle size of 2 μm to 50 μm, a sum of the amount of the sub-micro copper particles contained and the amount of the micro copper particles contained is 80% by mass or greater on the basis of a total mass of the metal particles, and the amount of the sub-micro copper particles contained is 30% by mass to 90% by mass on the basis of a sum of a mass of the sub-micro copper particles and a mass of the micro copper particles.

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