The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 25, 2025
Filed:
Sep. 16, 2021
Applicant:
Resonac Corporation, Tokyo, JP;
Inventors:
Hideo Nakako, Tokyo, JP;
Toshiaki Tanaka, Tokyo, JP;
Dai Ishikawa, Tokyo, JP;
Yoshinori Ejiri, Tokyo, JP;
Michiko Natori, Tokyo, JP;
Assignee:
Resonac Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22F 3/10 (2006.01); B22F 1/12 (2022.01); F28D 15/04 (2006.01);
U.S. Cl.
CPC ...
B22F 3/1035 (2013.01); B22F 1/12 (2022.01); F28D 15/046 (2013.01); B22F 2301/10 (2013.01); B22F 2304/10 (2013.01);
Abstract
Provided is a copper paste for forming a wick of a heat pipe, the copper paste containing copper particles, thermally decomposable resin particles, a dispersion medium for dispersing the copper particles and the thermally decomposable resin particles, and a thermally decomposable resin that is soluble in the dispersion medium.