The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 08, 2025
Filed:
Apr. 24, 2019
Showa Denko Materials Co., Ltd., Tokyo, JP;
Yoshinori Ejiri, Tokyo, JP;
Hideo Nakako, Tokyo, JP;
Yuki Kawana, Tokyo, JP;
Motoki Yonekura, Tokyo, JP;
Shinichirou Sukata, Tokyo, JP;
Manabu Ishii, Tokyo, JP;
Masaru Fujita, Tokyo, JP;
Michiko Natori, Tokyo, JP;
Masahiro Kimura, Tokyo, JP;
Ryo Honna, Tokyo, JP;
Resonac Corporation, Tokyo, JP;
Abstract
An aspect of the invention is a method for producing a substrate having through-silicon vias, the method including a preparation step of preparing a silicon substrate provided with through-holes, in which the through-holes communicate with both principal surfaces; a copper sintered body formation step of forming a copper sintered body having a porous structure such that the copper sintered body fills at least the through-holes; a resin impregnation step of impregnating the copper sintered body with a curable resin composition; and a resin curing step of curing the curable resin composition impregnated into the copper sintered body to form an electric conductor that includes the copper sintered body having pores filled with a resin cured product, and providing through-silicon vias in the through-holes.