The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 22, 2021
Filed:
Sep. 07, 2016
Hitachi Chemical Company, Ltd., Tokyo, JP;
Dai Ishikawa, Tokyo, JP;
Yuki Kawana, Tokyo, JP;
Chie Sugama, Tokyo, JP;
Hideo Nakako, Tokyo, JP;
Yoshinori Ejiri, Tokyo, JP;
Kazuhiko Kurafuchi, Tokyo, JP;
Showa Denko Materials Co., Ltd., Tokyo, JP;
Abstract
Provided is copper paste for joining including metal particles, and a dispersion medium. The metal particles include sub-micro copper particles having a volume-average particle size of 0.12 μm to 0.8 μm, and flake-shaped micro copper particles having a maximum particle size of 1 μm to 20 μm, and an aspect ratio of 4 or greater, and the amount of the micro copper particles contained, which are included in the metal particles and have a maximum particle size of 1 μm to 20 μm and an aspect ratio of less than 2, is 50% by mass or less on the basis of a total amount of the flake-shaped micro copper particles.